

Not the same chips, but ddr5, gddr7, and hbm2 are made off the same wafers in the same plants. The issue is allocation in wafer and production time skewing towards the higher-margin items. DDR5 additionally is being made more into the server ecc variant, which companies are buying in droves for cost-efficient MOE inference.






Not OP but I think this guy is remembering a scene from silicon valley, not from reality. That said it’s probably not that far off. Amazon smart devices absolutely have this “feature” in production today-- and it’s opt-out, not opt-in.
https://en.wikipedia.org/wiki/Amazon_Sidewalk